发明名称 Laser cutting device, laser cutting method, and laser cutting system
摘要 It is an object of the present invention to provide a laser cutting device, a method for laser cutting and a laser cutting system with which it is possible to perform laser cutting of parts of various shapes through easy control, to prevent adhesion of dust or similar and scratches being formed in cut parts, and to send out such parts while reliably supporting the same. The present laser cutting device 5 is comprised with a material transferring means A that transfers a sheet-like material 11 in a feeding direction, a processing head B that is capable of irradiating laser light towards the material, a head moving means C that makes the processing head move in the feeding direction X and a width direction Y of the material, an upstream-sided supporting means (belt conveyer mechanism F) that supports the material on an upstream side of a downward portion of the processing head and that expands and contracts a supporting region R 2 for the material accompanying movements of the processing head in the feeding direction, and a downstream-sided supporting means (belt conveyer mechanism E) that supports cut parts on a downstream side of a downward portion of the processing head and that expands and contracts a supporting region R 1 for the cut parts accompanying movements of the processing head in the feeding direction.
申请公布号 US2006118529(A1) 申请公布日期 2006.06.08
申请号 US20030514014 申请日期 2003.01.21
申请人 AOKI TATSUHIKO;HAMAJI MASANORI;HIROSE YASUHIRO 发明人 AOKI TATSUHIKO;HAMAJI MASANORI;HIROSE YASUHIRO
分类号 B23K26/38;B23K26/08;B23K26/16 主分类号 B23K26/38
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