PACKAGING FOR HIGH POWER INTEGRATED CIRCUITS USING SUPERCRITICAL FLUID
摘要
A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a supercritical fluid that transports heat from the devices to a heat sink in thermal contact with the enclosure.
申请公布号
WO2006060396(A2)
申请公布日期
2006.06.08
申请号
WO2005US43139
申请日期
2005.11.30
申请人
MAYO FOUNDATION FOR MEDICAL EDUCATION AND RESEARCH;WILKINS, WENDY, L.;GILBERT, BARRY, K.