| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film which retains higher levels of heat resistance, high-frequency adaptability and flexibility and is excellent in isotropy of the film, and its manufacturing method. SOLUTION: The polyimide film has a plane orientation coefficient of 0.80-0.89 and an MOR-c value of the film of≤1.30. The method is for manufacturing the above-characterized polyimide film by applying and drying a polyimide precursor solution on a support medium to form a self-supporting green film and going through a heat-treatment step which is performed at 150-500°C and comprises at least an initial-stage heat-treatment and a later-stage heat-treatment. Here, the residual solvent rate in the green film at the beginning of the heat-treatment is≤35 mass%, and the initial-stage heat-treatment is performed under a condition wherein the temperature is 150-250°C and the wind speed is 0-0.5 m/sec. COPYRIGHT: (C)2006,JPO&NCIPI |
