发明名称 CONTACT FOR VACUUM VALVE, AND VACUUM VALVE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a contact for vacuum valve minimal in contact erosion and having stable contact resistance characteristics and to provide a vacuum valve using it. SOLUTION: The contact for vacuum valve is constituted of a Cu-Cu<SB>2</SB>Te contact having a composition consisting of 0.001 to 10 wt.% of Cu<SB>2</SB>Te particles and the balance mainly Cu. Moreover, the Cu<SB>2</SB>Te particles, having a shape and a size in which the length of a side (a) is 2.5 to 500μm and the length of a side (b) nearly perpendicular to the side (a) is 10 to 1,000μm and, further, the proportion (b/a) between the length of the side (a) and the length of the other side (b) ranges from 2 to 400, comprise≥90% of the area of all the Cu<SB>2</SB>Te particles in a plane parallel to an electrically conducting plane. By this method, the contact for vacuum valve minimal in contact erosion and having stable contact resistance characteristics can be obtained. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006144031(A) 申请公布日期 2006.06.08
申请号 JP20040331430 申请日期 2004.11.16
申请人 SHIBAFU ENGINEERING CORP;TOSHIBA CORP;HUMAN UNITEC CO LTD 发明人 OKUTOMI ISAO;KUSANO TAKASHI;HONMA MITSUTAKA;YAMAMOTO ATSUSHI;SEKI KEISEI;OSABE KIYOSHI;TEJIMA KOICHI
分类号 C22C9/00;C22C5/06;C22C27/04;C22C27/06;C22C29/06;C22C29/08;C22C29/10;H01H33/66 主分类号 C22C9/00
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