| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing material eliminating the production of a brittle layer in a substrate and capable of obtaining the sufficient melting and spreading of an Au-Sn portion. SOLUTION: A Cu layer or a Cu alloy layer having the thickness of 0.05-20μm is formed on one side of the substrate having a low expansion coefficient such as kovar material, 42 alloy material or the like while a sealing layer consisting of an Au-Sn alloy is formed on the surface of the Cu layer or the Cu alloy layer. COPYRIGHT: (C)2006,JPO&NCIPI
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