| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed-wiring board capable of forming a bump having a top diameter not remarkably thinned even when the bump at a high aspect ratio is formed by an etching. SOLUTION: In the method for manufacturing the printed-wiring board, a process in which a plating is precipitated on the surface of a metallic layer having a thickness, the process in which an etching resist pattern is formed to at least the bump forming section of the plated surface, the process in which the plating exposed from the etching resist pattern is removed by the etching, and the process in which the etching resist pattern is peeled, are conducted in required numbers as one set. The method has the process in which the final etching resist pattern is formed, the process in which the metallic layer exposed from the final etching resist pattern is removed, and the process in which the final etching resist pattern is peeled. COPYRIGHT: (C)2006,JPO&NCIPI |
