| 摘要 |
PROBLEM TO BE SOLVED: To provide a defect reviewing system, a defect reviewing method, a defect analyzing method and a method of manufacturing a semiconductor device by which the purpose of inspection can be limited and a process that generates defects can be easily specified. SOLUTION: The defect reviewing system 10 obtains image data of regions subjected to a review of a semiconductor wafer WF which is placed on a stage 11 by a data obtaining mechanism 12 for reviewing. An image memory system 124 sorts the image data of the regions subjected to the review according to predetermined items and stores the classified data. A stage control system 141 in a review operation control mechanism 14 selects only coordinate data which meet predetermined conditions from a mask image database 142 out of coordinate data of defect positions obtained by a defect inspection as regions subjected to the review, for example. In this way, the stage 11 is controlled with respect to its movement and positioning to the regions subjected to the review according to the coordinate data selected by the stage control system 141. COPYRIGHT: (C)2006,JPO&NCIPI
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