| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a flip chip packaging method and flip chip packaging device which are applicable to the flip chip packaging of a net generation LSI and have a high productivity and reliability. <P>SOLUTION: After a semiconductor chip 20 is arranged in the recess 5 of a mold 1, the mold 1 arranged with the semiconductor chip 20 is disposed on a circuit board 10. Thereafter, after a melted resin 13 containing a melted solder powder is injected into a space 6 formed with the circuit board 10 and the mold 1, the melted resin 13 filled in the space 6 is cured. In the injection process of the melted resin 13, the melted solder powder self-gathers between the connection terminal 11 of the circuit board 10 and the electrode terminal 21 of the semiconductor chip 20, whereby a connection body 22 is formed which electrically connects the connection terminal 11 to the electrode terminal 21. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
