| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a technique for heat management in an integrated circuit and in the other use more specifically, relating to a fluid structure and heat transmission. <P>SOLUTION: A heat transmission device comprises one or a plurality of microchannels suitable for housing heat transmission fluids. One or a plurality of microchannels comprise protruded structures on the inner surface of at least one of one or a plurality of microchannels constituted such that the flow of the heat transmission fluid passing through one or a plurality of microchannels is affected. The structure can comprises a strut in which a hydrophobic film is coated. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
