EPOXY RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition improved so as to afford a low coefficient of linear expansion in the planar direction of a laminate and a low coefficient of linear expansion in the thickness direction thereof and to provide prepreg using the epoxy resin composition, the laminate using the prepreg and further a printed wiring board using the laminate. SOLUTION: The epoxy resin composition comprises an epoxy resin, a curing agent and a flexible component. The curing agent is a novolak resin of phenols. Fine particles composed of a resin having a core-shell structure and the shell part compatibilizing with the epoxy resin are contained as the flexible component. COPYRIGHT: (C)2006,JPO&NCIPI