| 摘要 |
The surface metallising is formed by a feed (12) for electromagnetic energy to be emitted, at least one metallising structure (30) and a conductive track (20) extending along the substrate (10) periphery and coupling the feed to the metallising structure. The metallising structure contains a first conductive track section (31), extending at the substrate side, opposite to the feed, up to the feed, as well as a first metallising platelet (32). The metallising structure is located on one front face of the rectangular substrate. Independent claims are included for a printed circuit board and mobile telephone. |
