首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
BESCHICHTETE MEDIZINISCHE GERÄTE UND VERFAHREN ZUR STERILISATION
摘要
申请公布号
DE60112777(T2)
申请公布日期
2006.06.08
申请号
DE2001612777T
申请日期
2001.10.01
申请人
CORDIS CORP., MIAMI LAKES
发明人
BODNAR, STANKO;LLANOS, H.;ROLLER, B.;SCOPELIANOS, ANGELO
分类号
A61L2/20;A61B17/00;A61B17/04;A61B17/06;A61B17/064;A61B17/11;A61B17/115;A61B17/54;A61F2/00;A61L17/14;A61L27/34;A61L29/08;A61L31/10;A61L31/16
主分类号
A61L2/20
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Heat-resistant insulating layer-provided separator containing heat-resistant resin and oxidation-resistant ceramic particles and non-aqueous electrolyte secondary battery
Organic light emitting device
Light-emitting diode and electronic device
P-contact with more uniform injection and lower optical loss
Power source for an accommodating intraocular lens
Method for manufacturing a photovoltaic module with annealing for forming a photovoltaic layer and electrically conducting region
Transistors, methods of manufacturing a transistor and electronic devices including a transistor
Semiconductor device with multiple-functional barrier layer
Method of fabricating semiconductor device
Semiconductor device with isolating layer on side and bottom surfaces
Semiconductor device having inductor
Solid-state image pickup element and solid-state image pickup element mounting structure
Semiconductor device wherein an oxide semiconductor layer has a degree of crystallization of 80% or more
CMOS nanowire structure
Poly gate extension design methodology to improve CMOS performance in dual stress liner process flow
High voltage semiconductor devices and methods of making the devices
Damascene re-distribution layer (RDL) in fan out split die application
Package apparatus and manufacturing method thereof
Semiconductor substrate, semiconductor package structure and method of making the same
Recessed lead leadframe packages