| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having good fluidity, small warpage and excellent soldering crack resistance and suitable for the sealing of an area mounting semiconductor and provide a semiconductor device produced by using the composition. SOLUTION: The epoxy resin composition for the sealing of an area mounting semiconductor contains (A) a biphenyl-type epoxy resin, (B) a phenolic resin, (C) a cure accelerator and (D) an inorganic filler as essential components wherein the phenolic resin (B) contains≥20 wt.% phenolaralkyl resin having a biphenylene skeleton and≥20 wt.% polyfunctional phenolic resin in the total phenolic resin and the amount of the inorganic filler (D) is≥85 wt.% and≤93 wt.% in the total epoxy resin composition. The semiconductor device has a semiconductor element mounted on one surface of a substrate and essentially only the surface of the substrate having the mounted semiconductor element is sealed with the epoxy resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
|
