| 摘要 |
PROBLEM TO BE SOLVED: To simplify device configuration so as to reduce running cost while improving the reliability of the electric connection between a conductor layer for forming electric circuits and a metal conductor generated. SOLUTION: Conductive particulates 1 are made to float in carrier gas in an aerosol formation room 20, and the aerosol is made to blow off from a nozzle 25 to a via hole 50 formed in a multilayer wiring board 14. On the assumption that the diameter of conductive particulates 1 is 0.3-10μm, when the conductive particulates 1 are made to collide with the conductor layer of a multilayer wiring board 14 at about 600 m per second, conductive particulates 1 are melt to the conductor layer of the multilayer wiring board 14 by collision energy so as to make it possible to electrically connect the conductor layer of the surface of the multilayer wiring board 14 with an internal conductor layer. COPYRIGHT: (C)2006,JPO&NCIPI |
