发明名称 CONDUCTIVE PATTERN AND METHOD OF FORMING IT
摘要 PROBLEM TO BE SOLVED: To provide a conductive pattern which can apply an organic molecule also to a conductive material including an organic molecule which can be formed accurately certainly, in which a conductive material is not limited to a hydrophilic object, the thickness of a conductive pattern is not restricted by the risk of pattern collapse, which can be formed with sufficient productivity and can be applied to the conductive material including an organic molecule. SOLUTION: First, a photoresist layer 5 which divides a region for forming a channel region for forming a channel part by an organic semiconductor as a recess 6 on a silicon substrate 1. Then, the hydrophilic treatment of ashing by oxygen plasma, ozonization under ultraviolet light irradiation, etc., is performed, and a hydrophilic group 7 is formed on the front surface of the substrate. Then, the front surface of the substrate is covered with a mixed solution of the water of a hydrophilic organic semiconductor module (PEDOT/PSS) by application. Moisture is evaporated, and an organic semiconductor layer 8 is formed in the recess 6. Then, the photoresist layer 5 is exfoliated from the front surface of the substrate by lift-off processing. Thereby, electric insulating between each conductive pattern 8 is guaranteed. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006147910(A) 申请公布日期 2006.06.08
申请号 JP20040337175 申请日期 2004.11.22
申请人 SONY CORP 发明人 YASUDA RYOICHI
分类号 H01L29/786;H01L21/336;H01L51/05;H01L51/50;H05B33/10 主分类号 H01L29/786
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