| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate material for heat-resistant adhesive tape, low in hygroscopicity and excellent in thickness accuracy, interlaminar releasability and electrical insulation. SOLUTION: The substrate material for heat-resistant adhesive tape consists of a nonwoven fabric comprising wholly aromatic polyester fiber. The nonwoven fabric has a moisture absorption of 0.1% or less at 25°C and 90% RH, a density of 0.1-1.3 g/cm<SP>3</SP>and a thickness accuracy of A±0.1A(μm) ( wherein A is the average thickness(μm) of the nonwoven fabric ). COPYRIGHT: (C)2006,JPO&NCIPI
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