| 摘要 |
PROBLEM TO BE SOLVED: To develop a method for building-in an IC to a booklet for more cheaply and efficiently manufacturing an IC built-in type booklet and a manufacturing device of the booklet and to provide the form and manufacturing device of a passport, in which an IC chip is built, in order to solve a developing problem. SOLUTION: The booklet, which is formed by collating heat-sealable base materials, is fed one by one so as to turn over the heat-sealable base material by a turning-over mechanism in order to hold the booklet in its V-shape and insert an IC sheet delivered from an IC sheet feeding mechanism in the V-shape and then fix the IC sheet to the booklet through the heating and press-bonding by a heating and press-bonding mechanism. COPYRIGHT: (C)2006,JPO&NCIPI
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