| 摘要 |
A reinforced solder is formed by mixing particles of a solder material capable of forming a metal matrix and a reinforcing particulate to form a particulate mixture; compressing the mixture at room temperature to form a solid compact; and sintering the compact to form a particulate composite in which the reinforcing particulate is embedded in a metal matrix formed from the solder material. The solder material can be a lead-free solder material. There is also provided a reinforced solder which includes a lead-free metal matrix and a reinforcing particulate embedded in the metal matrix. The metal matrix includes a combination of tin, copper, silver, and indium having volume ratios of about 91.4:0.5:4.1:4. The reinforcing particulate has an average diameter less than 100 nm. The reinforced solder has a melting point between 180° C. to 230° C.
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