A multilayer printed circuit board

摘要

A process for manufacturing a multilayer printed circuit board comprises a step for providing openings in an interlayer insulating layer, and a step for filling up the openings to construct via holes in a manner of plugging the openings in the interlayer insulating layer. Electroplating may be used to fill up the openings and, at the same time, build up a conductor layer. The electroplating is performed using an aqueous solution containing a metal ion and 0.1 to 1.5 mmol/L of at least one additive selected from the group consisting of thioureas, cyanides and polyalkylene oxides as a plating solution. The multilayer printed circuit board comprises a core board and, as constructed on both sides thereof, a buildup wiring layer obtainable by building up the interlayer insulating layer and the conductor layer alternately with the via holes interconnecting the conductor layers.