发明名称 |
COMPOSITE PLATING APPARATUS |
摘要 |
A composite plating apparatus includes a cylindrical electrode which is positioned in a hollow section of a workpiece with a surrounding gap left therebetween. A plurality of through-holes are formed across the thickness of an outer wall of the cylindrical electrode. Composite plating liquid is jetted out through the through-holes and impinge on the inner surface of the hollow section to thereby produce turbulence. The turbulent liquid provides a uniform distribution of ceramic particles in the liquid. As a result, the ceramic particles can be co-deposited uniformly in a metallic matrix, and hence a uniform abrasion-resistant characteristic is obtained all over a resultant composite plating film.
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申请公布号 |
CA2218784(C) |
申请公布日期 |
2006.06.06 |
申请号 |
CA19972218784 |
申请日期 |
1997.10.20 |
申请人 |
HONDA GIKEN KOGYO KABUSHIKI KAISHA (ALSO TRADING AS HONDA MOTOR CO., LTD .)< |
发明人 |
ISHIGAMI, OSAMU;ISHIKAWA, MAKOTO;OGAWA, YOSHIMITSU |
分类号 |
C25D15/00;C25D5/08;C25D7/04 |
主分类号 |
C25D15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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