| 摘要 |
PROBLEM TO BE SOLVED: To protect parts located around a semiconductor device against breakage and ignition caused by a ground fault caused by a short-circuit fault in a semiconductor element. SOLUTION: The semiconductor device is configured so as to be equipped with a case 30 with an open top and a bottom where the semiconductor element 25 is arranged, a silicon gel 32 filling the case 30 so as to cover the semiconductor element 25, a lid 50 which covers the open top of the case 30, and a structural member 51 which restricts the direction and width of an opening provided to the lid 50 when the silicon gel 32 fractures so as to form the opening in the lid 50. The one-side of the lid 50 is pinched between the structural member 51 and the case 30 so as to restrict the direction and width of the opening formed to the lid 50 when the lid 50 is opened, and the structural member 51 is provided to the case 30 so as to form a gap between the structural member 51 itself and the lid 50 at the side of the lid 50 opposite to its pinched side. COPYRIGHT: (C)2006,JPO&NCIPI
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