发明名称 Resin-molded component for signal reader and method for molding thereof
摘要 The present invention provides a resin-molded component for signal reader, which is light in weight and is able to improve the vibration damping property and to increase the resonance frequency, and which is excellent in heat dissipation. Specifically, it provides a resin-molded component for signal reader structured by 55 to 75% by weight of liquid crystalline polymer (A) composed of structural units expressed by general formulae (I) through (IV): <?in-line-formulae description="In-line Formulae" end="lead"?>-O-Ar<SUB>1</SUB>-CO- (I) <?in-line-formulae description="In-line Formulae" end="tail"?> <?in-line-formulae description="In-line Formulae" end="lead"?>-CO-Ar<SUB>2</SUB>-CO- (II) <?in-line-formulae description="In-line Formulae" end="tail"?> <?in-line-formulae description="In-line Formulae" end="lead"?>-O-Ar<SUB>3</SUB>-O- (III) <?in-line-formulae description="In-line Formulae" end="tail"?> <?in-line-formulae description="In-line Formulae" end="lead"?>-O-Ar<SUB>4</SUB>-CO- (IV) <?in-line-formulae description="In-line Formulae" end="tail"?> (where, Ar<SUB>1 </SUB>is 2,6-naphthalene group, Ar<SUB>2 </SUB>is selected from 1,2-phenylene group, 1,3-phenylene group, and, 1,4-phenylene group, Ar<SUB>3 </SUB>is selected from 1,3-phenylene group, 1,4-phenylene group, and p,p'-polyphenylene group, and Ar<SUB>4 </SUB>is 1,4-phenylene group); 20 to 10% by weight of inorganic hollow sphere (B1); and 25 to 15% by weight of fibrous inorganic filler (B2), and has 1.4 or smaller specific gravity d, 0.5 W/m.K or larger thermal conductivity lambda, and 10 GPa or larger flexural modulus.
申请公布号 US2006113391(A1) 申请公布日期 2006.06.01
申请号 US20050283892 申请日期 2005.11.22
申请人 POLYPLASTICS CO., LTD., 发明人 FUKATSU HIROKI
分类号 G02B5/00 主分类号 G02B5/00
代理机构 代理人
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