发明名称 |
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor |
摘要 |
A semiconductor wafer is manufactured in such a way that a main surface of a semiconductor substrate is partitioned into a plurality of semiconductor element forming regions defined by scribing regions, wherein at least one pattern for measuring a width of a cut region and its positional shift is formed in proximity to a peripheral portion of the semiconductor substrate on a scribing line. The pattern is constituted by a plurality of micro patterns that are aligned in a reverse V-shape to traverse the scribing line and a pair of elongated patterns that partially overlap seal rings formed in both sides of the scribing line. It is possible to form a channel whose width is larger than the width of the cut region on the backside of the semiconductor substrate in correspondence with the scribing region in order to avoid the formation of chipping, cracks, and burrs during cutting.
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申请公布号 |
US2006113637(A1) |
申请公布日期 |
2006.06.01 |
申请号 |
US20050270334 |
申请日期 |
2005.11.09 |
申请人 |
YAMAHA CORPORATION |
发明人 |
FUJITA HARUMITSU;SASAKI MASAHARU |
分类号 |
H01L21/30;H01L23/544 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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