| 摘要 |
PROBLEM TO BE SOLVED: To provide a very reliable jet-flow type soldering apparatus having no movable part in molten solder. SOLUTION: The soldering apparatus is provided with a pool tank 18 which can control the pressure of a space in contact with liquid surface when solder is stored in the pool tank, a recovery tank 19 whose upper end section is opened in the air, a solder return pipe 29 which is stood in the pool tank 18 with the upper end section opened and with the lower end section interconnected with the recovery tank 19 through the pool tank 18, and a solder feed pipe 26 which is stood in the recovery tank 19 with the upper end section opened and with the lower end section located at a lower position than the upper end section of the solder return pipe 29 and also interconnected with the pool tank 18 through the recovery tank 19. Fluid-pressure equipment and the like are connected to the pool tank 18 as needed. COPYRIGHT: (C)2006,JPO&NCIPI |
