| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board where a metallic member is firmly brazed on a wiring layer formed on the surface of an insulating substrate, corrosion such as gap corrosion is less likely generated in a material for brazing or in a wiring layer, the attenuation of a signal transmitted between the wiring layers is reduced, and a semiconductor device is operated more accurately and more stably. <P>SOLUTION: The wiring board 6 includes the first wiring layer 2 and the second wiring layer 3 with the metallic member 8 brazed on the surface of the insulating substrate 1. A copper-plated layer 7a coats the surface of the first wiring layer, and a nickel-plated layer 7b coats the surface of the second wiring layer 3. The first wiring layer 2 and the second wiring layer 3 are electrically connected by an inner wiring layer 4 formed in the insulating substrate 1. The inner wiring layer 4 is electrically connected to the first wiring layer 2 and the second wiring layer 3 by a through hole conductor 4a with the through hole conductor 4a penetrating only a ceramic green sheet that is a topmost layer of the insulating substrate 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
