| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can also sufficiently cool a control circuit together with a power circuit and besides is small-sized. <P>SOLUTION: Coolers 52, 54, 56 and 58 are stacked alternately with semiconductor element parts 42, 44 and 46, which constitute a power circuit, so as to cool the semiconductor element parts 42, 44 and 46 from both their sides. A controller 30, which constitutes the control circuit, is arranged at the side of the stack consisting of the semiconductor element parts 42, 44 and 46 and the coolers 52, 54, 56 and 58. Then, the controller 30 is connected with a heat conductive member 60 which is joined with a face not in contact with the semiconductor element part 42 of the cooler 52 on the uppermost stage of the stack, that is, a cooling face which does not serve the cooling of the semiconductor element parts 42, 44 and 46. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
