| 摘要 |
PROBLEM TO BE SOLVED: To provide an interconnect structure used for an electronic device. SOLUTION: The interconnect structure includes a flexible material, and has a front surface (52) and a rear surface (54), furthermore comprises a first substrate (50) constituted so that it may hold a sensor on the front surface (52), and a second substrate (56) connected to the rear surface (54) of the first substrate including a rigid material. The interconnect structure is prepared inside a detector (26) module used for an imaging system (10). COPYRIGHT: (C)2006,JPO&NCIPI |
