发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To form a sidewall spacer without shaving a semiconductor substrate in a process for forming the LDD (Lightly-Doped Drain) of an MOS transistor. SOLUTION: This method for manufacturing a semiconductor device comprises a step for forming a gate electrode 102 on a semiconductor substrate 100 through a gate insulating film 101, a step for depositing an organic/inorganic hybrid film 106 represented by SiC<SB>w</SB>H<SB>x</SB>O<SB>y</SB>N<SB>z</SB>(w>0, x≥0, y>0, z≥0) to cover the gate electrode 102, a step for transforming a predetermined portion of the organic/inorganic hybrid film 106 into an oxidation layer 108, a step for removing the oxidation layer 108 selectively so that a sidewall spacer 109 composed of the organic/inorganic hybrid film is formed on the sidewall of the gate electrode 102. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006140175(A) 申请公布日期 2006.06.01
申请号 JP20040325900 申请日期 2004.11.10
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 DOSHITA HIDEKI
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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