| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for bonding which is easy to operate, enables simplification of the bonding process, combines resins with a strong adhesive force and does not emit volatile organic compounds originating from organic solvents, and the like, in the process steps involved. SOLUTION: This method for bonding comprises filling an inorganic colloidal liquid with water as a dispersing medium between a resin section of equipment A having the resin section at least on the surface and a resin section of equipment B having the resin section at least on the surface, removing the water as the dispersing medium by drying and combining the resin sections of equipment A and equipment B together via an inorganic fine particle layer derived from the inorganic colloidal liquid. COPYRIGHT: (C)2006,JPO&NCIPI
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