| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave branching filter where which first and second surface acoustic wave filter chips are mounted by a flip-chip bonding method in a package member, the isolation between the first and second surface acoustic wave filter chips is improved, and proper attenuation characteristics are achieved. SOLUTION: In the surface acoustic wave branching filter, the first acoustic wave filter chip, having a low center frequency and the second acoustic wave filter chip 4 having a relatively high center frequency are jointed to the chip-mounting surface of the package member 8; a signal via hole electrode and a ground via hole electrode penetrating at least a part of the package member 8 are provided; and the distance between the signal via hole electrode V6 and the ground via hole electrode V7 is the smallest of the distances between via hole electrodes V1 to V9 which are constituted to the package member 8 and connected to different potentials. COPYRIGHT: (C)2006,JPO&NCIPI
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