发明名称 Substrate having a reinforced compound slot
摘要 A substrate (606) for use in a print head die (144, fig.5) comprises a compound slot (604) comprising an elongate trench portion (802) that extends along a long axis, and at least one reinforcement structure (806) within the compound slot (604). The reinforcement structure (806) having a surface (1302) nearest the trench (802) and a surface (612) away from the trench (802). The surface (1302) nearest the trench (802) being generally non-planar; and the substrate (606) being stronger in bending in or out of a plane of at least a portion of a first surface (610) of the substrate (606) than if said at least one reinforcement structure (806) were not present. The substrate (606) may further comprise a pair of generally opposed trench defining side walls (805p-q, fig.8), at least one side wall (805, fig.8) having a profile a majority of which is not parallel to a plane containing the long axis where the plane is orthogonal to a first surface of the substrate (606). This would make the substrate (606) stronger in torsion around an axis parallel to a long axis of the substrate (606) than if the at least one reinforcement structure (806) were not present.
申请公布号 GB2420529(A) 申请公布日期 2006.05.31
申请号 GB20050024982 申请日期 2003.07.17
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 JEFFREY R POLLARD
分类号 B41J2/05;B41J2/14;B41J2/16 主分类号 B41J2/05
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