| 摘要 |
PROVIDED IS A CHIP SCALE MARKER AND A MARKING METHOD. THE METHOD FOR MARKING, USING A CHIP SCALE MARKER, WHEREIN A LASER BEAM IS IRRADIATED FROM A LASER SOURCE (131) ON THE WAFER CHIPS VIA A GALVANO SCANNER (136) AND AN F-THETA LENS (137), THE METHOD COMPRISING: (A) MEASURING POSITION INFORMATION OF A PLURALITY OF POINTS ON THE WAFER; (B) TRANSMITTING THE MEASURED POSITION INFORMATION TO A CONTROLLER; (C) CALCULATING A DEVIATION BETWEEN A MARKING DISTANCE BETWEEN THE F-THETA LENS AND THE POINT ON THE WAFER SURFACE AND A FOCUS DISTANCE OF THE F-THETA LENS FROM THE TRANSMITTED POSITION INFORMATION; AND (D) IF THE DEVIATION IS GREATER THAN A PREDETERMINED VALUE IN THE STEP (C), CALIBRATING THE WAFER CHIP TO BE POSITIONED AT THE FOCUS DISTANCE OF THE F-THETA LENS. ACCORDING TO THE CHIP SCALE MARKER, IT IS POSSIBLE TO INCREASE MARKING QUALITY BY MEASURING AND CALIBRATING A VERTICAL DISTANCE FROM AN F-THETA LENS OF THE LASER SYSTEM TO EACH WAFER CHIP SO THAT THE WAFER CHIP IS MARKED AT A PREDETERMINED DISTANCE FROM THE F-THETA LENS OF THE LASER SYSTEM. |
