SEMICONDUCTOR DEVICE, ITS FABRICATION METHOD AND ELECTRONIC DEVICE

摘要

A SEMICONDUCTOR DEVICE (10) COMPRISES: A SEMICONDUCTOR CHIP (1) HAVING A CIRCUIT FABRICATION SURFACE (1X) AND AN ELECTRODE (1C);A RESIN (7) FOR COVERING THE CIRCUIT FABRICATION SURFACE (1X) OF THE SEMICONDUCTOR CHIP (1);AND A RESIN FILM (2) FOR COVERING A REAR SURFACE (1Y) FACING THE CIRCUIT FABRICATION SURFACE (1X) OF THE SEMICONDUCTOR CHIP (1).WITH THE CONFIGURATION DESCRIBED ABOVE, A CRACK CAN BE PREVENTED FROM BEING GENERATED IN THE SEMICONDUCTOR CHIP (1).(FIG.1)