发明名称 |
Process for producing electro-optic hybrid circuit board |
摘要 |
The present invention provides a process for producing an electro-optic hybrid circuit board, which comprises the steps of: forming an undercladding layer (3) on a metal foil side (2) of a metal transfer sheet (4) that comprises a releasable substrate (1) and a metal foil (2) formed thereon; forming a core layer (5) on the undercladding layer (3); forming an overcladding layer (6) so as to cover the core layer (5) and the undercladding layer (3); stripping the releasable substrate (1) from the metal foil (2); and etching the metal foil (2) to thereby form a predetermined conductor pattern (7). |
申请公布号 |
EP1662282(A1) |
申请公布日期 |
2006.05.31 |
申请号 |
EP20050025696 |
申请日期 |
2005.11.24 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
NAITOU, RYUUSUKE;USUI, HIDEYUKI;MOCHIZUKI, AMANE |
分类号 |
G02B6/13;G02B6/12;H05K1/14 |
主分类号 |
G02B6/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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