发明名称 Process for producing electro-optic hybrid circuit board
摘要 The present invention provides a process for producing an electro-optic hybrid circuit board, which comprises the steps of: forming an undercladding layer (3) on a metal foil side (2) of a metal transfer sheet (4) that comprises a releasable substrate (1) and a metal foil (2) formed thereon; forming a core layer (5) on the undercladding layer (3); forming an overcladding layer (6) so as to cover the core layer (5) and the undercladding layer (3); stripping the releasable substrate (1) from the metal foil (2); and etching the metal foil (2) to thereby form a predetermined conductor pattern (7).
申请公布号 EP1662282(A1) 申请公布日期 2006.05.31
申请号 EP20050025696 申请日期 2005.11.24
申请人 NITTO DENKO CORPORATION 发明人 NAITOU, RYUUSUKE;USUI, HIDEYUKI;MOCHIZUKI, AMANE
分类号 G02B6/13;G02B6/12;H05K1/14 主分类号 G02B6/13
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