| 摘要 |
A conductor layer (13) is formed on one surface of a semiconductor substrate (11) having a functional element formed therein, with an insulating layer (12) interposed therebetween, and a through hole (TH1) is then formed at a predetermined position in the semiconductor substrate. Furthermore, a support sheet is attached to the other surface of the semiconductor substrate (11), and the conductor layer (13) and the top of the support sheet are connected using a wire (14). A portion in which the conductor layer (13), the wire (14) and the through hole (TH1) are formed is sealed with resin (16), and the support sheet is removed. Furthermore, a conductor layer (15) is formed on an end portion (14a) of the wire (14) which is exposed from the other surface of the semiconductor substrate (11). |
