| 摘要 |
An electrodeposition film forming method includes forming an electrodeposited film of an electrodeposition coating material having good thermal fluidity by a first electrodeposition; forming an electrodeposition film in a very small through-hole provided on a conductive or semiconductive substrate; removing electrodeposited film at an opening portion of the through-hole under a wet-coated condition; and hardening the electrodeposition film to obtain a flat portion other than the opening portion. Then, a second electrodeposition film of an electrodeposition coating material having good thermal fluidity is formed around the opening portion and is hardened to coat uncoated portions of the opening portion remaining after the first deposition. Accordingly, a flat inner surface of the through-hole is obtained, any exposed portions of an underlayer at the opening of the through-hole are covered and the opening of the through-hole is maintained.
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