MEANS TO ELIMINATE BUBBLE ENTRAPMENT DURING ELECTROCHEMICAL PROCESSING OF WORKPIECE SURFACE

摘要

Methods and systems are provided to eliminate bubble entrapment during electrochemical processing of a substrate, wherein a rigid plate (500) with fluid openings (520) allow process solution (505) to flow between the front surface (510) of the substrate (503) and an electrode (506). The plate (500) includes a protruding region (524). In operation, the protruding region causes a raised solution surface (526) to touch the front surface (510) of the wafer prior to complete immersion of the substrate (503) in the solution (505).