| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a very small metal bump forming method capable of consistently forming very small bumps by a gas deposition method for depositing metal particles by ejecting metal particles and carrier gas to only a bump forming part of a metal member formed on one face side of a substrate. <P>SOLUTION: An inverted tapered recessed part 34 in which the bottom face diameter with a bump forming part of a pattern 12 exposed to the bottom face is larger than the diameter of an opening in a surface of a resin layer 30 is formed in the resin layer 30 as a mask layer to cover the pattern 12 formed on one face side of a substrate 10. Then, metal particles obtained by evaporating the metal are carried with carrier gas to the bump forming part of the pattern 12 exposed to a bottom face of a recessed part 34, and a conical bump 14 is formed by the gas deposition method to eject the metal particles from a nozzle 25 for deposition, and the resin layer 30 is peeled therefrom. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
