| 摘要 |
The invention relates to the fabrication and testing of a chip with a package ( 2 ) having connecting pins ( 1 ) as well as to mounting the package ( 2 ) on a board ( 5 ), whereby in order to combine the advantages of a package ( 2 ) with inline connecting pins ( 1 ) with the advantages of a package ( 2 ) with offset connecting pins ( 11, 12 ), the package ( 2 ) is fabricated with inline connecting pins ( 1 ) and inserted into a test socket ( 3 ) for testing. Immediately before mounting on the board ( 5 ), at least one connecting pin, preferably every second connecting pin ( 12 ), of the package ( 2 ) is bent inward by a bending tool ( 6 ) so as to achieve an offset arrangement of the connecting pins ( 11, 12 ). The package ( 2 ) is preferably mounted on the board ( 5 ) using the bending tool ( 6 ). A simple, inexpensively produced test socket ( 3 ) is sufficient for the purpose of testing the chip. An inexpensively produced guide brace ( 4 ), for example, is suitable as a packaging means. Since every second connecting pin ( 12 ) is not bent inward immediately before insertion of the connecting pins ( 11, 12 ), no subsequent corrective alignment of the offset connecting pins ( 11, 12 ) is required. |
