| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the matter of a prior art that a cavity requires some margin for containing a chip electronic component and the strength of a substrate is lowered by an air gap in the substrate caused by the margin, and to solve the matter of other prior art that since the chip electronic component is pressure bonded while being mounted on a ceramic green sheet, irregularities appear on the surface of the substrate to cause deformation of internal wiring conductors or via conductors. <P>SOLUTION: In the production process of a ceramic multilayer substrate, a first ceramic green sheet 111A embedding a chip electronic component 112 is formed on a carrier film 100, the first ceramic green sheet 111A is stripped from the carrier film 100 and laid in layer together with a second ceramic green sheet 111B to form a multilayer green sheet 111 which is then sintered. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
