| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for cutting a brittle material with high accuracy and for a short time even if its plate thickness is large. <P>SOLUTION: After laser beams L emitted from a laser oscillator 4 are reflected with a reflecting mirror 7, they are collected by a beam collecting means 5 and then a beam collection part C is formed in a plate brittle material 2. The beam collecting means 5 is vibrated by a vibrating means 6 to a plate thickness direction of the beam collecting means 5. The beam collection part is reciprocated to the plate thickness direction while moving along a predetermined cutting line Q by moving the brittle material with a working table 3 and then a modification area T is formed with a wave locus to the plate thickness direction in the brittle material. The brittle material can be cut by advancing cracks from the modification area to the surface of the brittle material. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
