发明名称 Laser processing method and laser processing apparatus
摘要 Ultrashort pulse laser processing bores, welds or cuts objects (work pieces) by converging ultrashort laser pulses by a lens on the objects (work pieces) positioned at the focus and heating small spots or narrow lines on the objects (work pieces). Shortage of a focal depth of the lens prevents the ultrashort pulse laser processing from positioning the object (a work piece) and forming a deep, constant-diameter cylindrical hole. Z-parameter is defined to be Z = 2fc Š t/ Š i<2>, where Š t is a FWHM pulse width of the ultrashort pulse laser, Š i is a FWHM beam diameter of the ultrashort pulse, f is a focal length of the lens and c is the light velocity in vacuum. Selection of an optical system including a diffraction-type lens which gives the Z-parameter less than 1 (Z < 1) prolongs the focal depth. Expansion of the focal depth facilitates the positioning of objects (work pieces) and enables the ultrashort pulse laser apparatus to bore a deep, constant-diameter cylindrical hole.
申请公布号 GB2420306(A) 申请公布日期 2006.05.24
申请号 GB20050023099 申请日期 2005.11.11
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD 发明人 MANABU SHIOZAKI;KEIJI FUSE;KENICHI WATATANI
分类号 B23K26/06;B23K26/20;B23K26/38;B23K26/40;B29C65/16 主分类号 B23K26/06
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