| 摘要 |
A resin sealing method for an electronic part (2) using a cope (13), a drag (14), an intermediate die (15), and a releasing film (17). The releasing film (17) is held by the drag (14) and the intermediate die (15), subjected to a specified tension, and covers the cavity (16) of the drag (14). In this case, the side face (54b) of the cavity is covered by the releasing film (17). Accordingly, the releasability of the side face (54b) of the cavity from a hard resin (10) is improved. As a result, the hard resin (10) can be prevented from being damaged near the side face (54b) of the cavity. |
