发明名称 HIGH THERMAL CYCLE CONDUCTOR SYSTEM
摘要 <p>The present invention provides to a method for the production of metallized ceramic substrates that demonstrate superior adhesion characteristics when surface mounted components are soldered to their surface metallization(s) and that provide superior stability when the completed circuits are exposed to high-temperature storage conditions.</p>
申请公布号 KR20060050106(A) 申请公布日期 2006.05.19
申请号 KR20050062998 申请日期 2005.07.12
申请人 E.I. DU PONT DE NEMOURS AND COMPANY 发明人 BACHER RUDOLPH JOHN;NEEDES CHRISTOPHER R.;ORZEL ANTHONY J.
分类号 H05K3/46;H05K1/09 主分类号 H05K3/46
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