APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE

摘要

To inhibit application unevenness by optimizing the state of a slit nozzle. In a slit nozzle 41, the first lip side 410a of a first lip 410 is arranged in the position where only a level difference D is lower than the second lip side 411a of a second lip 411. Preliminary application processing is performed by applying resist liquid to a roller 71 of a spare applying member while making the slit nozzle 41 scan in the direction ((-X) direction) opposite to the scanning direction ((+X) direction) of the slit nozzle 41 in this application processing. The application processing is performed by applying the resist liquid to a substrate 90 while making the slit nozzle 41 scan in the direction (+X) which is normalized by the preliminary application processing.