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发明名称
LEAD-FREE SOLDER PASTES WITH INCREASED RELIABILITY
摘要
申请公布号
KR20060050102(A)
申请公布日期
2006.05.19
申请号
KR20050062952
申请日期
2005.07.12
申请人
W.C. HERAEUS GMBH
发明人
BRAND ALEXANDER;GREBNER STEFFEN;SCHMITT WOLFGANG;TRODLER JOERG
分类号
B23K35/00
主分类号
B23K35/00
代理机构
代理人
主权项
地址
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