| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that, in the case of a conventional composite multilayer substrate, there is generated a difference between the amount of the shrinkage of a conductor material and that of a ceramic material for a conductor pattern and a large wave (vertical difference) is generated on a laminate 2, when baking the substrate as a conductor film such as a bottom surface conductor film 2C and a capacitance forming conductor film 2D and a via conductor (not shown in Figure) are provided as the conductor pattern, and to solve the problem that, in the case of a laminate 2 comprising a cavity structure, a larger difference, in the amount of shrinkage, is generated between the section having cavity 2B and that having no cavity to grow a wave, the wave is prominent due to the thinner laminate 2 in modern low profile structure leading to unstable attitudes of electronic components when they are mounted, and the electronic components are difficult to be mounted. <P>SOLUTION: A composite multilayer substrate 10 has the lamination structure of a resin 11 and ceramic 12 with a cavity 10A formed thereon. The cavity 10A comprises a through-hole 12B formed in the ceramic 12, and a recess 11B formed on the resin 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
