| 摘要 |
<P>PROBLEM TO BE SOLVED: To form uniform electrodes having no wettability/expandability with a narrow pitch. <P>SOLUTION: A forming method for connective bumps has a process for forming on a substrate 11 having electrodes 13 in predetermined places a mask 24M having openings in the corresponding places to the electrodes 13; a process for forming in each opening up to its predetermined height a first metal film 31 having low wettability/expandability in relation to a foundational metal; a process for forming in each opening a second metal film repeatedly on the first metal film; a process for fusing the first and second metals as the mask is left; and a process for removing the mask thereafter. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
