| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor memory device equipped with an on-die termination circuit for largely reducing power consumption, while the data are being inputted to a semiconductor device. <P>SOLUTION: This semiconductor memory device is provided with a data input/output pad DQ, a data input buffer 60 for buffering and transmitting data to be transmitted via the data input/output pad DQ, an on-die termination pad DQODT to which an on-die termination voltage to be transmitted from a board to which a memory device has been connected is applied, an on-die termination resistance RTT3 arranged in between the on-die termination pad DQODT and the data input/output pad DQ and a switch for connecting the on-die termination resistance RTT3 to the on-die termination pad DQODT, while the data are inputted to the data input buffer 60. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
