| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device packaging method on substrate that shortens the time required for packaging and improves quality and an equipment for packaging the same. <P>SOLUTION: This electronic device packaging equipment 1 on substrate comprises a means 12 for packaging an electronic device 11 on a substrate 10, a means 17 for supplying the substrate 10 to a predetermined location, a means 14 for supplying the electronic device 11 to a packaging means 12, a substrate returning means 32 for conveying the substrate 10 with the electronic device 11 mounted by the packaging means 12 to a predetermined location, a carrier 100 for holding a substrate supplied by the substrate conveyance method 17 in a detachable fashion and having a thermal capacity larger than a predetermined value, and a carrier heating transportation means 101 for conveying and heating the carrier 100 from a substrate transportation start position 13a of the substrate conveyance means 13 to a predetermined location. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
